Zalman Releases New Water Cooler, Passive Cooling Cube

From DailyTech: At the 2013 Consumer Electronics Show Zalman Technology Comp. (KOE:A090120), a top computer peripherals designer, echoed the sentiments of many of its Taiwanese rivals, expressing a desire to further differentiate and add color to its lineup (which currently occupies the power supply, case, and cooler niches).

One product it showed off was a new closed-loop liquid cooler design, which Zalman claims is the first such product to include a full aluminum radiator heatsink with copper heat pipes. Traditionally such designs simply use a fan and radiator design, but Zalman says that by adding heat pipes as well, it greatly ups the cooler's performance.

The cooler is designed to dissipate up to 400 watts of power consumption on the CPU and is officially branded the "CI Water Cooler".

The device will ship in late March or early April. Possible launch colors include white, blue, and black -- Zalman may opt to launch all three, or pick the one it thinks customers connect to the most. A price has not been announced, but something around ~$200 USD sounds about right.

The cooler will accommodate a broad array of Intel Corp. (INTC) and Advanced Micro Devices, Inc. (AMD) CPU socket designs.

Zalman also showed off a large cube-shaped passive cooler, which it dubs "Fanless Cooler". The design features 10 copper heatpipes and a "hexahedron" aluminum heatsink.

The cooler is situated well off the motherboard, so that it won't clash with high profile memory modules (e.g. modules with heat-spreaders). The cube can add an optional ultra-quiet 92 mm fan inside the hollow cubic metal radiator cage to allow for mild overclocks. The cooler will ship in March likely priced in the $170-190 range.

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